Semiconductor Components
Semiconductor Precision Parts & Consumables – Key Components for Front-End and Back-End Equipment
The semiconductor industry requires semiconductor precision parts with exceptional accuracy, cleanliness, and stability to ensure process reliability and yield improvement. tspt specializes in semiconductor parts manufacturing, offering complete solutions from front-end chamber consumables, probe card components, to back-end testing consumables. With advanced 5-axis machining, precision grinding, and strict inspection capabilities, we deliver high-quality components that meet the stringent standards of global semiconductor equipment manufacturers and testing service providers.
Machining Capabilities
Our manufacturing facilities are equipped with a wide range of semiconductor precision machining equipment, enabling us to deliver high-accuracy components that meet the stringent requirements of the semiconductor industry. From 5-axis machining centers to ultra-precision grinding machines, each piece of equipment plays a critical role in achieving tight dimensional tolerances and mirror-finish surface roughness.
By combining these advanced machining capabilities with strict quality inspection systems, we ensure every semiconductor component whether chamber consumables, probe card parts, or back-end testing consumables meets international standards for accuracy, reliability, and performance.
Machining Equipment List
| Equipment Type | Amount | Function | Semiconductor Application | Precision |
|---|---|---|---|---|
| 5-Axis Machining Centers | 2 | Simultaneous multi-axis machining for complex surfaces and high-precision parts | Chamber consumables, probe card structures | ±0.002 mm; Ra 0.2–0.4 µm |
| High-Speed Machining Centers | 16 | High-speed cutting, for thin-wall and fine components | Probe card carriers, testing parts | ±0.005 mm |
| Ultra-Precision Machining Center | 3 | Micro-feature machining, mirror-finish surface processing | Probe card microstructures, critical consumables | ±0.001 mm; Ra 0.05 µm |
| CNC Horizontal Machining Centers | 13 | High-rigidity cutting for large parts | Chamber main structures, large-scale consumables | ±0.005 mm |
| CNC Cylindrical Grinders | 5 | High-precision OD grinding | Locating pins, cylindrical components | ±0.002 mm; Ra 0.1–0.2 µm |
| CNC Internal Grinders | 4 | Precision ID grinding | Chamber bores, fixture holes | ±0.0015 mm; Ra 0.1 µm |
| Universal Cylindrical Grinders | 12 | Precision OD grinding | Testing consumables, shafts | ±0.003 mm |
Inspection & Measurement Equipment
| Brand | Equipment | Method | Units |
|---|---|---|---|
| TRIMOS | 2D Height Gauge | Contact | 1 |
| ZEISS | 3D CMM Measuring | Contact | 1 |
| JMT | 2.5D Optical Projector | Non-Contact | 2 |
| Keyence | 2.5D Optical Projector | Non-Contact | 1 |
| Nikon | 2.5D Optical Projector | Non-Contact | 1 |
| Keyence | 3D Scanned type CMM | Non-Contact | 1 |
| Keyence | 3D Laser Scanning Microscope | Non-Contact | 1 |
Quality Inspection
To guarantee the reliability of every semiconductor precision component, we operate a comprehensive quality inspection system. Our facilities are equipped with advanced metrology instruments such as ZEISS coordinate measuring machines (CMM), TRIMOS Vectra Touch height gauge, Renishaw eccentricity measuring systems, automated vision measurement equipment, surface roughness testers, and hardness testers.
Each component—whether chamber consumables, probe card parts, or back-end testing consumables—is inspected for dimensional accuracy, concentricity, surface finish (Ra), and material strength. By combining state-of-the-art measurement technology with strict quality control standards, we ensure our semiconductor components consistently meet international specifications and deliver long-term performance in demanding applications.
Frequently Asked Questions
Our semiconductor precision machining equipment ensures tolerances down to ±0.005 mm and surface finishes as fine as Ra 0.05 µm, meeting the stringent requirements of chamber consumables, probe card parts, and back-end testing components.
We work with a wide range of materials including aluminum alloys, stainless steel, ceramics, and composite materials, commonly used in semiconductor chambers, test fixtures, and consumables.
Every component undergoes strict inspection with ZEISS CMM, TRIMOS Vectra Touch, Renishaw measurement systems, and surface roughness testers, ensuring compliance with international standards for accuracy and reliability.
Lead times vary depending on complexity and volume. For standard semiconductor consumables and test parts, delivery can be as short as 3–4 weeks, with expedited services available upon request.
Yes. We provide flexible production from prototyping to volume manufacturing, helping semiconductor equipment makers and testing service providers shorten development cycles while maintaining quality consistency.
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